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等离子体去胶机(高性价比)

简要描述:等离子体去胶机(高性价比) Isotropic dry etching of polymer (photo resist)
Cleaning of silicon (or glass) wafer surface
Removal of native oxide on wafer

  • 产品型号:
  • 厂商性质:代理商
  • 更新时间:2023-09-06
  • 访  问  量:151

详细介绍

等离子体去胶机(高性价比)

仪器应用
 Isotropic dry etching of polymer (photo resist)
 Cleaning of silicon (or glass) wafer surface
 Removal of native oxide on wafer


等离子体去胶机(高性价比)技术参数:
 Sample size & throughput : 4 ~ 8inch, Single wafer
 RF power : 600W @13.56MHz, Auto matching control
 Substrate chuck : Heating or Cooling available (selectable)
 Process gas : O2, CF4 ,Ar, N2
 Gas supply method : Showerhead type
 Ultimate pressure : ≤ 5×10-3Torr
 Vacuum pump : Rotary pump
 Process control : Auto process control (PLC)


常用工艺参数:
Photoresist Etch

 

gas100% O2
operating pressure100 millitorr
power level100 watts
etch rate997 angstroms/min
uniformity+/- 5%

 
Nitride Etch

 

gas95% CF4 / 5% O2
operating pressure100 millitorr
power level100 watts
etch rate450 angstroms/min
uniformity+/- 5%

 
BiPolar Silicon Glass (BPSG) Etch

 

gas95% CF4 / 5% O2
operating pressure100 millitorr
power level100 watts
etch rate520 angstroms/min
uniformity+/- 5%

 
PolySilicon Glass (PSG) Etch

 

gas95% CF4 / 5% O2
operating pressure100 millitorr
power level100 watts
etch rate450 angstroms/min
uniformity+/- 5%

 
Oxide Etch (SiO2)

 

gas95% CF4 / 5% O2
operating pressure100 millitorr
power level100 watts
etch rate200 angstroms/min
uniformity+/- 10%

 
Aluminum Etch*

 

gas80% BCl3 /20% Cl2
operating pressure150 millitorr
power level150 watts
etch rate200 angstroms/min
uniformity+/- 5%

 

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